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HD1, Blind And Buried Vias
  • HD1, Blind And Buried Vias
HD1, Blind And Buried Vias
Relevant description: Shengyi S1000-2M, 16 layer second-order board, board thickness 1.7mm, process immersion gold+electric gold fingers, minimum hole 0.2mm
Special process: Sinking gold+electric gold finger, second-order, resin plug hole
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